Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
August 14, 2007
Patent Application Number
10930510
Date Filed
August 31, 2004
Patent Primary Examiner
Patent abstract
A method and apparatus are disclosed for forming a tapered contact structure over a contact pad. The tapered contact structure may be used to securely anchor an overlying solder bump or solder ball. Additionally, the tapered contact structure allows the use of either larger contact pads or, alternately, allows a greater density of contact pads to be achieved on an integrated circuit substrate.
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