US Patent 7256115 Asymmetric plating
Patent 7256115 was granted and assigned to Micron Technology on August, 2007 by the United States Patent and Trademark Office.
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Patent abstract
A method and apparatus are disclosed for forming a tapered contact structure over a contact pad. The tapered contact structure may be used to securely anchor an overlying solder bump or solder ball. Additionally, the tapered contact structure allows the use of either larger contact pads or, alternately, allows a greater density of contact pads to be achieved on an integrated circuit substrate.
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US Patent 07256115 Asymmetric plating US Patent 7256115 Asymmetric plating
Infobox
Patent Number
0725611500
Patent Number
725611500
Edits on 28 Mar, 2023
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
072561150
Date of Patent
August 14, 2007
0Patent Application Number
109305100
Date Filed
August 31, 2004
0Official Website
Patent Primary Examiner
Edits on 26 Sep, 2022
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
072561150
Date of Patent
August 14, 2007
0Patent Application Number
109305100
Date Filed
August 31, 2004
0Official Website
Patent Primary Examiner
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US Patent 07256115 Asymmetric plating
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07256115
Date of patent
August 14, 2007
Patent application number
10930510
Date Filed
August 31, 2004
Patent primary examiner
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