Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
August 14, 2007
Patent Application Number
10908441
Date Filed
May 12, 2005
Patent Primary Examiner
Patent abstract
A method for treating an edge portion of a wafer with a plasma or select chemical formulation in order to enhance adhesion characteristics and inhibit delamination of a layer of material from the wafer surface only on the edge portion that is being treated. Alternatively, the method may be utilized to effectuate a cleaning of an edge portion of a wafer.
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