US Patent 7256148 Method for treating a wafer edge
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Patent abstract
A method for treating an edge portion of a wafer with a plasma or select chemical formulation in order to enhance adhesion characteristics and inhibit delamination of a layer of material from the wafer surface only on the edge portion that is being treated. Alternatively, the method may be utilized to effectuate a cleaning of an edge portion of a wafer.
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US Patent 07256148 Method for treating a wafer edge US Patent 7256148 Method for treating a wafer edge
Infobox
Patent Number
0725614800
Patent Number
725614800
Edits on 6 Apr, 2023
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
072561480
Date of Patent
August 14, 2007
0Patent Application Number
109084410
Date Filed
May 12, 2005
0Official Website
Patent Primary Examiner
Edits on 23 Sep, 2022
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
072561480
Date of Patent
August 14, 2007
0Patent Application Number
109084410
Date Filed
May 12, 2005
0Official Website
Patent Primary Examiner
Edits on 16 Jun, 2022
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US Patent 07256148 Method for treating a wafer edge
Infobox
Is a
Patent jurisdiction
Patent number
07256148
Date of patent
August 14, 2007
Patent application number
10908441
Date Filed
May 12, 2005
Patent primary examiner
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