Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
August 21, 2007
Patent Application Number
11308405
Date Filed
March 22, 2006
Patent Primary Examiner
Patent abstract
Embodiments of the present invention provide a thin-film coil assembly. The coil assembly includes a substrate, at least two layers of conductive material on top of the substrate, and one layer of insulating material between the two layers of conductive material, wherein the two layers of conductive material are in contact with two interconnects, respectively, which extends substantially vertical to the substrate.
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