US Patent 7257882 Multilayer coil assembly and method of production
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Patent abstract
Embodiments of the present invention provide a thin-film coil assembly. The coil assembly includes a substrate, at least two layers of conductive material on top of the substrate, and one layer of insulating material between the two layers of conductive material, wherein the two layers of conductive material are in contact with two interconnects, respectively, which extends substantially vertical to the substrate.
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US Patent 07257882 Multilayer coil assembly and method of production US Patent 7257882 Multilayer coil assembly and method of production
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Patent Number
0725788200
Patent Number
725788200
Edits on 23 Mar, 2023
Golden AI
Infobox
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Patent Jurisdiction
Patent Number
072578820
Date of Patent
August 21, 2007
0Patent Application Number
113084050
Date Filed
March 22, 2006
0Official Website
Patent Primary Examiner
Edits on 26 Sep, 2022
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
072578820
Date of Patent
August 21, 2007
0Patent Application Number
113084050
Date Filed
March 22, 2006
0Official Website
Patent Primary Examiner
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US Patent 07257882 Multilayer coil assembly and method of production
Infobox
Is a
Patent jurisdiction
Patent number
07257882
Date of patent
August 21, 2007
Patent application number
11308405
Date Filed
March 22, 2006
Patent primary examiner
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