Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
August 21, 2007
Patent Application Number
10787563
Date Filed
February 24, 2004
Patent Primary Examiner
Patent abstract
Solder balls may be arranged in hexagonal array on an integrated circuit package. The hexagonal array may increase the solder ball density, reducing solder ball fatigue. In some embodiments, the hexagonal array may be utilized under the die shadow and an orthogonal array may be used outbound thereof.
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