US Patent 7259453 Hexagonal array structure for ball grid array packages
Patent 7259453 was granted and assigned to Intel on August, 2007 by the United States Patent and Trademark Office.
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Patent abstract
Solder balls may be arranged in hexagonal array on an integrated circuit package. The hexagonal array may increase the solder ball density, reducing solder ball fatigue. In some embodiments, the hexagonal array may be utilized under the die shadow and an orthogonal array may be used outbound thereof.
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US Patent 07259453 Hexagonal array structure for ball grid array packages US Patent 7259453 Hexagonal array structure for ball grid array packages
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Patent Number
0725945300
Patent Number
725945300
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
072594530
Date of Patent
August 21, 2007
0Patent Application Number
107875630
Date Filed
February 24, 2004
0Official Website
Patent Primary Examiner
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
072594530
Date of Patent
August 21, 2007
0Patent Application Number
107875630
Date Filed
February 24, 2004
0Official Website
Patent Primary Examiner
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US Patent 07259453 Hexagonal array structure for ball grid array packages
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07259453
Date of patent
August 21, 2007
Patent application number
10787563
Date Filed
February 24, 2004
Patent primary examiner
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