US Patent 7262494 Three-dimensional package

Patent 7262494 was granted and assigned to Freescale Semiconductor on August, 2007 by the United States Patent and Trademark Office.

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Patent

Patent attributes

Current Assignee

Freescale Semiconductor

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

7262494

Date of Patent

August 28, 2007

Patent Application Number

11082096

Date Filed

March 16, 2005

Patent Primary Examiner

‌

Hung Vu

Patent abstract

An electronic device (60) including a first integrated circuit (IC) die (62) electrically connected to a first lead frame (64) and a second IC die (66) electrically connected to a second lead frame (68). The first lead frame (64) is electrically connected to the second lead frame (68) by at least one stud bump (72), which is selectively formed where an electrical connection between the first lead frame (64) and the second lead frame (68) is required. The first and second lead frames (64) and (68), the first and second IC dies (62) and (66), and the at least one stud bump (72) are encapsulated by a mold compound (74) to form a 3D package.

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