US Patent 7262494 Three-dimensional package
Patent 7262494 was granted and assigned to Freescale Semiconductor on August, 2007 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
March 16, 2005
Date of Patent
August 28, 2007
Patent Application Number
11082096
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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