Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Pei-Pei Ding0
Jao-Ching Lin0
Date of Patent
September 11, 2007
Patent Application Number
10670190
Date Filed
September 26, 2003
Patent Citations Received
Patent Primary Examiner
Patent abstract
A method of making a microstructure includes the steps of providing a circuit board that includes a dielectric layer and a conductor layer formed on the dielectric layer, forming a metal structure on the circuit board such that the metal structure extends through the dielectric layer, and removing at least a portion of the dielectric layer adjacent to the conductor layer and the metal structure to result in the microstructure.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
