US Patent 7267755 Method of making a microstructure using a circuit board

A method of making a microstructure includes the steps of providing a circuit board that includes a dielectric layer and a conductor layer formed on the dielectric layer, forming a metal structure on the circuit board such that the metal structure extends through the dielectric layer, and removing at least a portion of the dielectric layer adjacent to the conductor layer and the metal structure to result in the microstructure.