Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Takekazu Tanaka0
Date of Patent
September 25, 2007
0Patent Application Number
111689340
Date Filed
June 29, 2005
0Patent Primary Examiner
Patent abstract
A package for an electronic component according to one embodiment of the invention has a chip mounting area mounting a semiconductor chip in a hollow part of a metal plate and a plurality of connection electrodes to be connected to a substrate. The plurality of connection electrodes are formed in opposite sides of the rectangular metal plate and arranged asymmetrically with respect to a perpendicular bisector of the opposite sides.
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