US Patent 7274090 Electronic package and semiconductor device using the same
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Patent Inventor Names
Takekazu Tanaka0
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Patent abstract
A package for an electronic component according to one embodiment of the invention has a chip mounting area mounting a semiconductor chip in a hollow part of a metal plate and a plurality of connection electrodes to be connected to a substrate. The plurality of connection electrodes are formed in opposite sides of the rectangular metal plate and arranged asymmetrically with respect to a perpendicular bisector of the opposite sides.
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US Patent 07274090 Electronic package and semiconductor device using the same US Patent 7274090 Electronic package and semiconductor device using the same
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Patent Number
072740900
Patent Number
72740900
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Patent Jurisdiction
Patent Number
072740900
Date of Patent
September 25, 2007
0Patent Application Number
111689340
Date Filed
June 29, 2005
0Official Website
Patent Primary Examiner
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US Patent 07274090 Electronic package and semiconductor device using the same
Infobox
Is a
Patent jurisdiction
Patent number
07274090
Date of patent
September 25, 2007
Patent application number
11168934
Date Filed
June 29, 2005
Patent primary examiner
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