Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Tieyu Zheng0
James A. Irvine0
Date of Patent
October 9, 2007
0Patent Application Number
115136910
Date Filed
August 31, 2006
0Patent Primary Examiner
Patent abstract
An apparatus may include an integrated circuit package comprising a plurality of conductive pads and having a face, and a socket coupled to the integrated circuit package and to the conductive pads, the socket having a footprint. In some aspects, the footprint is smaller than the face.
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