US Patent 7278859 Extended package substrate
Patent 7278859 was granted and assigned to Intel on October, 2007 by the United States Patent and Trademark Office.
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Patent Inventor Names
James A. Irvine0
Tieyu Zheng0
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Article (+301 characters)
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Patent abstract
An apparatus may include an integrated circuit package comprising a plurality of conductive pads and having a face, and a socket coupled to the integrated circuit package and to the conductive pads, the socket having a footprint. In some aspects, the footprint is smaller than the face.
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US Patent 07278859 Extended package substrate US Patent 7278859 Extended package substrate
Infobox
Patent Number
072788590
Patent Number
72788590
Edits on 23 Sep, 2022
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Is a
Current Assignee
Patent Jurisdiction
Patent Number
072788590
Date of Patent
October 9, 2007
0Patent Application Number
115136910
Date Filed
August 31, 2006
0Official Website
Patent Primary Examiner
Edits on 17 Jun, 2022
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US Patent 07278859 Extended package substrate
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07278859
Date of patent
October 9, 2007
Patent application number
11513691
Date Filed
August 31, 2006
Patent primary examiner
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