US Patent 7285973 Methods for standardizing a test head assembly

Patent 7285973 was granted and assigned to Xilinx on October, 2007 by the United States Patent and Trademark Office.

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Patent

Patent attributes

Current Assignee

Xilinx

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

7285973

Date of Patent

October 23, 2007

Patent Application Number

10263491

Date Filed

October 3, 2002

Patent Primary Examiner

‌

Vinh P Nguyen

Patent abstract

A standardized test head assembly for testing a plurality of integrated circuit dice each having a different bonding pad footprint, the test head assembly including an arrangement of probe holes defined by a predetermined configuration of contact positions, wherein the predetermined configuration defines each of the different bonding pad footprints so that during testing the probe holes align with a subset of the bonding pads for each of the different bonding pad footprints.

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