US Patent 7285973 Methods for standardizing a test head assembly
Patent 7285973 was granted and assigned to Xilinx on October, 2007 by the United States Patent and Trademark Office.
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Patent abstract
A standardized test head assembly for testing a plurality of integrated circuit dice each having a different bonding pad footprint, the test head assembly including an arrangement of probe holes defined by a predetermined configuration of contact positions, wherein the predetermined configuration defines each of the different bonding pad footprints so that during testing the probe holes align with a subset of the bonding pads for each of the different bonding pad footprints.
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US Patent 07285973 Methods for standardizing a test head assembly US Patent 7285973 Methods for standardizing a test head assembly
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Patent Number
0728597300
Patent Number
728597300
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Official Website
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
072859730
Date of Patent
October 23, 2007
0Patent Application Number
102634910
Date Filed
October 3, 2002
0Official Website
Patent Primary Examiner
Edits on 25 Sep, 2022
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
072859730
Date of Patent
October 23, 2007
0Patent Application Number
102634910
Date Filed
October 3, 2002
0Official Website
Patent Primary Examiner
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US Patent 07285973 Methods for standardizing a test head assembly
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07285973
Date of patent
October 23, 2007
Patent application number
10263491
Date Filed
October 3, 2002
Patent primary examiner
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