Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
October 30, 2007
Patent Application Number
11184695
Date Filed
July 19, 2005
Patent Citations Received
Patent Primary Examiner
Patent abstract
A method of forming a semiconductor interconnect including, in the order recited: (a) providing a semiconductor wafer; (b) forming bonding pads in a terminal wiring level on the frontside of the wafer; (c) reducing the thickness of the wafer; (d) forming solder bumps on the bonding pads; and (e) dicing the wafer into bumped semiconductor chips.
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