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US Patent 11764071 Apparatus for stressing semiconductor substrates

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Patent attributes

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

Patent Inventor Names

Peter D. Albrecht

Vladimir V. Voronkov

Robert J. Falster

John A. Pitney

Date of Patent

September 19, 2023

Patent Application Number

16437988

Date Filed

June 11, 2019

Patent Citations

US Patent 7232591 Method of using an adhesive for temperature control during plasma processing

US Patent 7288492 Method for forming interconnects on thin wafers

US Patent 7416965 Method for producing a strained layer on a substrate and corresponding layer structure

US Patent 7432476 Substrate heat treatment apparatus

US Patent 7550309 Method for producing semiconductor wafer

US Patent 7642179 Semiconductor substrate and manufacturing method for the same

US Patent 7732301 Bonded intermediate substrate and method of making same

US Patent 7855127 Method for manufacturing semiconductor substrate

...

Patent Primary Examiner

Jeffrie R. Lund

Patent abstract

Apparatus for use in preparing heterostructures having a reduced concentration of defects including apparatus for stressing semiconductor substrates to allow them to conform to a crystal having a different crystal lattice constant.

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