Log in
Sign up
Golden has been acquired by ComplyAdvantage.Read about it here ⟶
‌

US Patent 11764071 Apparatus for stressing semiconductor substrates

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
June 11, 2019
Date of Patent
September 19, 2023
Patent Application Number
16437988
Patent Citations
‌
US Patent 7232591 Method of using an adhesive for temperature control during plasma processing
‌
US Patent 7288492 Method for forming interconnects on thin wafers
‌
US Patent 7416965 Method for producing a strained layer on a substrate and corresponding layer structure
‌
US Patent 7432476 Substrate heat treatment apparatus
‌
US Patent 7550309 Method for producing semiconductor wafer
‌
US Patent 7642179 Semiconductor substrate and manufacturing method for the same
‌
US Patent 7732301 Bonded intermediate substrate and method of making same
‌
US Patent 7855127 Method for manufacturing semiconductor substrate
‌
US Patent 7972663 Method and apparatus for forming a high quality low temperature silicon nitride layer
‌
US Patent 7994595 Strained semiconductor by full wafer bonding
•••
Patent Inventor Names
Peter D. Albrecht
Vladimir V. Voronkov
Robert J. Falster
John A. Pitney
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11764071
Patent Primary Examiner
‌
Jeffrie R. Lund

Find more entities like US Patent 11764071 Apparatus for stressing semiconductor substrates

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo