US Patent 7289867 Automated integrated circuit device manufacturing facility using distributed control

The system includes a plurality of process modules and an independent module controller for each of the plurality of process modules that is adapted to control the process tools within each of the process modules. Each of the independent module controllers performs at least run-to-run control of the processing tools, yield management analysis, scheduling of materials provided to and sent from the process module, and movement of wafers within the process module. One method of the present invention involves providing a plurality of process modules, each of which has an independent module controller that is adapted to perform at least run-to-run control of the processing tools within the process module, yield management analysis, scheduling of materials, and movement of wafers within the process module. The independent module controller for each of the process modules controls the process tools within its respective process module that are employed in forming a portion of the integrated circuit device.