Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Jung Joo Kim0
Date of Patent
November 20, 2007
0Patent Application Number
110274350
Date Filed
December 30, 2004
0Patent Primary Examiner
Patent abstract
A method of fabricating a via and a trench is disclosed. A disclosed method comprises: forming a via hole and a trench in a interlayer dielectric layer on a semiconductor substrate where a predetermined device is formed; depositing a thin Hf layer on the substrate; performing a thermal treatment of the substrate to getter oxygen and forming a barrier layer; and filling copper into the via hole and the trench.
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