US Patent 7307443 Test socket for an integrated circuit
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Patent Inventor Names
Boon Kiat Alex Chew0
Chye Lin Toh0
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Article (+441 characters)
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Patent abstract
A test socket for an integrated circuit, wherein the test socket has a first plurality of test points for making electrical contact with contacts of a laminate package and a second plurality of test points for making electrical contact with contacts of a lead frame package. The test socket is suitable for testing, at one time: a laminate package, or a lead frame package, or both a laminate package and a lead frame package.
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US Patent 07307443 Test socket for an integrated circuit US Patent 7307443 Test socket for an integrated circuit
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Patent Number
073074430
Patent Number
73074430
Edits on 19 May, 2023
Golden AI
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Official Website
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Patent Jurisdiction
Patent Number
073074430
Date of Patent
December 11, 2007
0Patent Application Number
116016090
Date Filed
November 17, 2006
0Official Website
Patent Primary Examiner
Edits on 17 Jun, 2022
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US Patent 07307443 Test socket for an integrated circuit
Infobox
Is a
Patent jurisdiction
Patent number
07307443
Date of patent
December 11, 2007
Patent application number
11601609
Date Filed
November 17, 2006
Patent primary examiner
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