US Patent 7312405 Module structure having embedded chips

A module structure having embedded chips mainly comprises a dielectric layer, at least a semiconductor chip embedded in the dielectric layer, and at least a circuit structure formed on the surface of the dielectric layer, the circuit structure electrically connected to the semiconductor chip via a plurality of conductive structures formed in the dielectric layer, for embedding the module structure in an electronic device, and electrically connecting the electronic device via the circuit structure on the surface of the dielectric layer.