Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Christina K. Williams0
Rainer E. Thomas0
Date of Patent
January 8, 2008
0Patent Application Number
111429720
Date Filed
June 1, 2005
0Patent Citations Received
Patent Primary Examiner
Patent abstract
An apparatus, method, and system for electronic device packaging having stacked dice are disclosed herein. A first die has a through silicon via formed therethrough. A second die is landed on the through silicon via of the first die. A mount having a lead is coupled to the through silicon via of the first die.
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