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US Patent 7317256 Electronic packaging including die with through silicon via

Patent 7317256 was granted and assigned to Intel on January, 2008 by the United States Patent and Trademark Office.

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Patent Citations Received
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US Patent 12014958 Microfeature workpieces and methods for forming interconnects in microfeature workpieces
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US Patent 11978656 Semiconductor with through-substrate interconnect
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US Patent 11973057 Through-silicon transmission lines and other structures enabled by same
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US Patent 11935866 Semiconductor device having reduced bump height variation
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Patent Inventor Names
Christina K. Williams0
Rainer E. Thomas0
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Patent abstract

An apparatus, method, and system for electronic device packaging having stacked dice are disclosed herein. A first die has a through silicon via formed therethrough. A second die is landed on the through silicon via of the first die. A mount having a lead is coupled to the through silicon via of the first die.

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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=073172560
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US Patent 07317256 Electronic packaging including die with through silicon via US Patent 7317256 Electronic packaging including die with through silicon via

Infobox
Patent Number
073172560
Patent Number
73172560
Edits on 26 Sep, 2022
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Infobox
Is a
Patent
Patent
0
Current Assignee
Intel
Intel
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
073172560
Date of Patent
January 8, 2008
0
Patent Application Number
111429720
Date Filed
June 1, 2005
0
Official Website
https://pdfpiw.uspto.gov/.piw?Docid=073172560
Patent Primary Examiner
‌
Kenneth Parker
0
Edits on 17 Jun, 2022
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Website URL
https://pdfpiw.uspto.gov/.piw?Docid=07317256
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created this topic on 23 Nov, 2021
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 US Patent 07317256 Electronic packaging including die with through silicon via

Infobox
Is a
Patent
Patent
Current assignee
Intel
Intel
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
07317256
Date of patent
January 8, 2008
Patent application number
11142972
Date Filed
June 1, 2005
Patent primary examiner
‌
Kenneth Parker

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