Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Cheng Chieh Tai0
Wen-Kun Yang0
Date of Patent
January 15, 2008
0Patent Application Number
112354850
Date Filed
September 26, 2005
0Patent Citations Received
Patent Primary Examiner
Patent abstract
The present invention provides an efficient test method and system for testing the IC package, such as BGA types of packages. With the present invention, manufacturer can have an easier way in testing various types of packages, including newer types. Manufacturer also can get the testing outcome which is more accurate. Furthermore, the present invention helps the manufacturer achieve a significant improvement in an IC packaging process.
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