US Patent 7319043 Method and system of trace pull test
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Patent Inventor Names
Cheng Chieh Tai0
Wen-Kun Yang0
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Patent abstract
The present invention provides an efficient test method and system for testing the IC package, such as BGA types of packages. With the present invention, manufacturer can have an easier way in testing various types of packages, including newer types. Manufacturer also can get the testing outcome which is more accurate. Furthermore, the present invention helps the manufacturer achieve a significant improvement in an IC packaging process.
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US Patent 07319043 Method and system of trace pull test US Patent 7319043 Method and system of trace pull test
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Patent Number
073190430
Patent Number
73190430
Edits on 23 Sep, 2022
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Patent Jurisdiction
Patent Number
073190430
Date of Patent
January 15, 2008
0Patent Application Number
112354850
Date Filed
September 26, 2005
0Official Website
Patent Primary Examiner
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US Patent 07319043 Method and system of trace pull test
Infobox
Is a
Patent jurisdiction
Patent number
07319043
Date of patent
January 15, 2008
Patent application number
11235485
Date Filed
September 26, 2005
Patent primary examiner
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