Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Eng C. Cheah0
Donald S. Fritz0
Date of Patent
January 15, 2008
0Patent Application Number
110751020
Date Filed
March 8, 2005
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A thermally enhanced wirebond BGA package having a laminate substrate, an IC device mounted on the substrate, and a metal cap defining a cavity inside the package between the IC device and the metal cap. A substantial portion of the cavity is filled with a thermally enhanced epoxy encapsulant establishing a thermal conduction path between the IC device and the metal cap. The BGA package may be further enhanced by bonding a metal heat slug on the laminate substrate and mounting the IC device on the slug.
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