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US Patent 7319051 Thermally enhanced metal capped BGA package

Patent 7319051 was granted and assigned to Altera on January, 2008 by the United States Patent and Trademark Office.

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Patent Citations Received
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US Patent 12087705 Package structure with warpage-control element
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Patent Citations Received
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US Patent 12021005 Semiconductor device including a thermal material
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Patent Inventor Names
Donald S. Fritz0
Eng C. Cheah0
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Patent abstract

A thermally enhanced wirebond BGA package having a laminate substrate, an IC device mounted on the substrate, and a metal cap defining a cavity inside the package between the IC device and the metal cap. A substantial portion of the cavity is filled with a thermally enhanced epoxy encapsulant establishing a thermal conduction path between the IC device and the metal cap. The BGA package may be further enhanced by bonding a metal heat slug on the laminate substrate and mounting the IC device on the slug.

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US Patent 07319051 Thermally enhanced metal capped BGA package US Patent 7319051 Thermally enhanced metal capped BGA package

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Patent Number
073190510
Patent Number
73190510
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=073190510
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Infobox
Is a
Patent
Patent
0
Current Assignee
Altera
Altera
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
073190510
Date of Patent
January 15, 2008
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Patent Application Number
110751020
Date Filed
March 8, 2005
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=073190510
Patent Primary Examiner
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Michael Lebentritt
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Website URL
https://pdfpiw.uspto.gov/.piw?Docid=07319051
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 US Patent 07319051 Thermally enhanced metal capped BGA package

Infobox
Is a
Patent
Patent
Current assignee
Altera
Altera
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
07319051
Date of patent
January 15, 2008
Patent application number
11075102
Date Filed
March 8, 2005
Patent primary examiner
‌
Michael Lebentritt

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