US Patent 7323421 Silicon wafer etching process and composition

Patent 7323421 was granted and assigned to MEMC Electronic Materials on January, 2008 by the United States Patent and Trademark Office.

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Is a

Patent

Patent attributes

Current Assignee

MEMC Electronic Materials

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

73234210

Patent Inventor Names

James R. Capstick0

Jozef G. Vermeire0

Judith A. Schmidt0

Mick Bjelopavlic0

Mark G. Stinson0

Thomas E. Doane0

Alexis Grabbe0

Guoqiang (David) Zhang0

...

Date of Patent

January 29, 2008

Patent Application Number

111523620

Date Filed

June 14, 2005

Patent Primary Examiner

‌

Binh X Tran

Patent abstract

A process for etching silicon wafers using a caustic etchant in the form of an aqueous solution comprising water, a hydroxide ion source, and a chelating agent. The process produces silicon wafers substantially free from diffused metal ions.

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