Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Tae-Sung Yoon0
Date of Patent
February 5, 2008
0Patent Application Number
112793440
Date Filed
April 11, 2006
0Patent Primary Examiner
Patent abstract
Provided is a semiconductor package accomplishing a fan-out structure through wire bonding in which a pad of a semiconductor chip is connected to a printed circuit board through wire bonding. A semiconductor package can be produced without a molding process and can be easily stacked on another semiconductor package while the appearance cracks and the warpage defects can be prevented.
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