US Patent 7327032 Semiconductor package accomplishing fan-out structure through wire bonding
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Patent Inventor Names
Tae-Sung Yoon0
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Patent abstract
Provided is a semiconductor package accomplishing a fan-out structure through wire bonding in which a pad of a semiconductor chip is connected to a printed circuit board through wire bonding. A semiconductor package can be produced without a molding process and can be easily stacked on another semiconductor package while the appearance cracks and the warpage defects can be prevented.
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US Patent 07327032 Semiconductor package accomplishing fan-out structure through wire bonding US Patent 7327032 Semiconductor package accomplishing fan-out structure through wire bonding
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Patent Number
073270320
Patent Number
73270320
Edits on 28 Apr, 2023
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Patent Jurisdiction
Patent Number
073270320
Date of Patent
February 5, 2008
0Patent Application Number
112793440
Date Filed
April 11, 2006
0Official Website
Patent Primary Examiner
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US Patent 07327032 Semiconductor package accomplishing fan-out structure through wire bonding
Infobox
Is a
Patent jurisdiction
Patent number
07327032
Date of patent
February 5, 2008
Patent application number
11279344
Date Filed
April 11, 2006
Patent primary examiner
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