Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
February 12, 2008
Patent Application Number
11521547
Date Filed
September 15, 2006
Patent Citations Received
Patent Primary Examiner
Patent abstract
The present invention relates to a method of manufacturing a chemical mechanical polishing pad which provides a chemical mechanical polishing pad which fully suppresses the occurrence of a scratch on the polished surface and has an excellent polishing rate.
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