Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hsiu-Yuan Hsu0
Kenzo Nakao0
Date of Patent
March 4, 2008
0Patent Application Number
113246180
Date Filed
January 3, 2006
0Patent Primary Examiner
Patent abstract
An IC socket for testing an IC package is provided including a socket body (10), a press cover (14) preferably pivotally mounted to a first longitudinal end (101) of the socket body so as to be rotatable with respect to the socket body, and a press member (12) disposed between the socket body and the press cover to have an end thereof (121) essentially pivotally mounted to the press cover at a position adjacent the first longitudinal end of the socket body. Thus, by providing the mounting of the press member to the press cover at such a position, a latching member (141) detachably attached to the press cover will be less damaged in comparison with the conventional IC socket.
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