Is a
Patent attributes
Current Assignee
0
Patent Jurisdiction
Patent Number
Patent Inventor Names
Fujio Ito0
Hiromichi Suzuki0
Date of Patent
March 4, 2008
0Patent Application Number
117124560
Date Filed
March 1, 2007
0Patent Primary Examiner
Patent abstract
A semiconductor device has an improved mounting reliability and has external terminals formed by exposing portions of leads from a back surface of a resin sealing member. End portions on one side of the leads are fixed to a back surface of a semiconductor chip, and portions of the leads positioned outside the semiconductor chip are connected with electrodes formed on the semiconductor chip through wires.
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