US Patent 7339259 Semiconductor device
Patent 7339259 was granted and assigned to Renesas Technology Corp on March, 2008 by the United States Patent and Trademark Office.
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Patent Inventor Names
Fujio Ito0
Hiromichi Suzuki0
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Patent abstract
A semiconductor device has an improved mounting reliability and has external terminals formed by exposing portions of leads from a back surface of a resin sealing member. End portions on one side of the leads are fixed to a back surface of a semiconductor chip, and portions of the leads positioned outside the semiconductor chip are connected with electrodes formed on the semiconductor chip through wires.
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US Patent 07339259 Semiconductor device US Patent 7339259 Semiconductor device
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Patent Number
073392590
Patent Number
73392590
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Official Website
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Is a
Current Assignee
0
Patent Jurisdiction
Patent Number
073392590
Date of Patent
March 4, 2008
0Patent Application Number
117124560
Date Filed
March 1, 2007
0Official Website
Patent Primary Examiner
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US Patent 07339259 Semiconductor device
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07339259
Date of patent
March 4, 2008
Patent application number
11712456
Date Filed
March 1, 2007
Patent primary examiner
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