Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
March 4, 2008
Patent Application Number
11536635
Date Filed
September 28, 2006
Patent Primary Examiner
Patent abstract
A package for an IC includes a carrier with a cavity formed on one of the major surfaces. Bumps of a semiconductor die are mated to contact pads located on the bottom of the cavity. The die is attached to the major surface of the carrier. The major surface creates a support which securely holds the chip in place with adhesive for assembly.
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