US Patent 7339278 Cavity chip package
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Patent abstract
A package for an IC includes a carrier with a cavity formed on one of the major surfaces. Bumps of a semiconductor die are mated to contact pads located on the bottom of the cavity. The die is attached to the major surface of the carrier. The major surface creates a support which securely holds the chip in place with adhesive for assembly.
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US Patent 07339278 Cavity chip package US Patent 7339278 Cavity chip package
Infobox
Patent Number
0733927800
Patent Number
733927800
Edits on 27 Apr, 2023
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
073392780
Date of Patent
March 4, 2008
0Patent Application Number
115366350
Date Filed
September 28, 2006
0Official Website
Patent Primary Examiner
Edits on 25 Sep, 2022
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
073392780
Date of Patent
March 4, 2008
0Patent Application Number
115366350
Date Filed
September 28, 2006
0Official Website
Patent Primary Examiner
Edits on 17 Jun, 2022
Golden AI
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Golden AI
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US Patent 07339278 Cavity chip package
Infobox
Is a
Patent jurisdiction
Patent number
07339278
Date of patent
March 4, 2008
Patent application number
11536635
Date Filed
September 28, 2006
Patent primary examiner
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