Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Kia Silverbrook0
Date of Patent
March 11, 2008
Patent Application Number
11066160
Date Filed
February 28, 2005
Patent Citations Received
Patent Primary Examiner
Patent abstract
A first substrate suitable for bonding to a second substrate using an adhesive is provided. The first substrate has a plurality of etched trenches defined in a first bonding surface. The etched trenches are configured for receiving the adhesive during bonding, thereby increasing the adhesive bond strength. The first substrates are exemplified by semiconductor chips.
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