US Patent 7341330 Substrates adapted for adhesive bonding
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Patent Inventor Names
Kia Silverbrook0
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Patent abstract
A first substrate suitable for bonding to a second substrate using an adhesive is provided. The first substrate has a plurality of etched trenches defined in a first bonding surface. The etched trenches are configured for receiving the adhesive during bonding, thereby increasing the adhesive bond strength. The first substrates are exemplified by semiconductor chips.
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US Patent 07341330 Substrates adapted for adhesive bonding US Patent 7341330 Substrates adapted for adhesive bonding
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Patent Number
07341330
Patent Number
7341330
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Official Website
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US Patent 07341330 Substrates adapted for adhesive bonding
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Is a
Patent jurisdiction
Patent number
07341330
Date of patent
March 11, 2008
Patent application number
11066160
Date Filed
February 28, 2005
Patent primary examiner
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