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US Patent 7341633 Apparatus for electroless deposition

Patent 7341633 was granted and assigned to Applied Materials on March, 2008 by the United States Patent and Trademark Office.

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Patent
Patent

Patent attributes

Current Assignee
Applied Materials
Applied Materials
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
7341633
Date of Patent
March 11, 2008
Patent Application Number
10965220
Date Filed
October 14, 2004
Patent Citations Received
‌
US Patent 11752518 Robot-centered coating system with multiple curing workstations
0
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US Patent 12009228 Low temperature chuck for plasma processing systems
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US Patent 11682560 Systems and methods for hafnium-containing film removal
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US Patent 11915950 Multi-zone semiconductor substrate supports
0
Patent Primary Examiner
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Laura Edwards
Patent abstract

Embodiments of the invention generally provide a fluid processing platform. The platform includes a mainframe having a substrate transfer robot, at least one substrate cleaning cell on the mainframe, and at least one processing enclosure. The processing enclosure includes a gas supply positioned in fluid communication with an interior of the processing enclosure, a first fluid processing cell positioned in the enclosure, a first substrate head assembly positioned to support a substrate for processing in the first fluid processing cell, a second fluid processing cell positioned in the enclosure, a second head assembly positioned to support a substrate for processing in the second fluid processing cell, and a substrate shuttle positioned between the first and second fluid processing cells and being configured to transfer substrates between the fluid processing cells and the mainframe robot.

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