Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
March 18, 2008
Patent Application Number
11349998
Date Filed
February 9, 2006
Patent Primary Examiner
Patent abstract
A method of making a circuitized substrate assembly wherein the assembly includes individual circuitized substrates bonded together. The substrates each include at least one opening, and a cover is placed over one of the openings and a quantity of conductive paste is positioned thereon prior to bonding the substrates. At least some of the paste is then forced up into an opening in the other substrate as a result of the bonding.
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