US Patent 7343674 Method of making circuitized substrate assembly
Patent 7343674 was granted and assigned to Endicott Interconnect Technologies, Inc. on March, 2008 by the United States Patent and Trademark Office.
All edits
Edits on 1 Sep, 2023
Golden AI
Edits made to:
Article (+446 characters)
Article
Patent abstract
A method of making a circuitized substrate assembly wherein the assembly includes individual circuitized substrates bonded together. The substrates each include at least one opening, and a cover is placed over one of the openings and a quantity of conductive paste is positioned thereon prior to bonding the substrates. At least some of the paste is then forced up into an opening in the other substrate as a result of the bonding.
Edits on 15 Jul, 2023
Golden AI
Edits made to:
Infobox (+1/-1 properties)
US Patent 07343674 Method of making circuitized substrate assembly US Patent 7343674 Method of making circuitized substrate assembly
Infobox
Patent Number
0734367400
Patent Number
734367400
Edits on 21 May, 2023
Golden AI
Edits made to:
Infobox (-1 properties)
Infobox
Official Website
Edits on 24 Apr, 2023
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
073436740
Date of Patent
March 18, 2008
0Patent Application Number
113499980
Date Filed
February 9, 2006
0Official Website
Patent Primary Examiner
Edits on 25 Sep, 2022
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
073436740
Date of Patent
March 18, 2008
0Patent Application Number
113499980
Date Filed
February 9, 2006
0Official Website
Patent Primary Examiner
Edits on 17 Jun, 2022
Golden AI
Edits made to:
Infobox (+1 properties)
Infobox
Website URL
Edits on 24 Nov, 2021
Golden AI
Edits made to:
Infobox (+8 properties)
US Patent 07343674 Method of making circuitized substrate assembly
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07343674
Date of patent
March 18, 2008
Patent application number
11349998
Date Filed
February 9, 2006
Patent primary examiner
Find more entities like US Patent 7343674 Method of making circuitized substrate assembly
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
