Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Masamitsu Ikumo0
Tadahiro Okamoto0
Eiji Watanabe0
Date of Patent
April 8, 2008
0Patent Application Number
111807800
Date Filed
July 14, 2005
0Patent Primary Examiner
Patent abstract
A multilayer wiring board having a plurality of wiring boards in which wiring layers and resin layers in each wiring board are alternately arranged in a laminated formation. In the multilayer wiring board, all the resin layers and the wiring layers, except a resin layer in the plurality of wiring boards, are separated in a same position between the plurality of wiring boards and the resin layer is continuous in the same position.
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