US Patent 7355124 Multilayer wiring board and its manufacturing method
All edits
Edits on 16 Sep, 2023
Golden AI
Edits made to:
Infobox (+3 properties)
Infobox
Patent Inventor Names
Eiji Watanabe0
Masamitsu Ikumo0
Tadahiro Okamoto0
Edits on 1 Sep, 2023
Golden AI
Edits made to:
Article (+448 characters)
Article
Patent abstract
A multilayer wiring board having a plurality of wiring boards in which wiring layers and resin layers in each wiring board are alternately arranged in a laminated formation. In the multilayer wiring board, all the resin layers and the wiring layers, except a resin layer in the plurality of wiring boards, are separated in a same position between the plurality of wiring boards and the resin layer is continuous in the same position.
Edits on 25 May, 2023
Golden AI
Edits made to:
Infobox (-1 properties)
Infobox
Official Website
Edits on 19 May, 2023
Golden AI
Edits made to:
Infobox (+1/-1 properties)
US Patent 07355124 Multilayer wiring board and its manufacturing method US Patent 7355124 Multilayer wiring board and its manufacturing method
Infobox
Patent Number
073551240
Patent Number
73551240
Edits on 25 Sep, 2022
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
073551240
Date of Patent
April 8, 2008
0Patent Application Number
111807800
Date Filed
July 14, 2005
0Official Website
Patent Primary Examiner
Edits on 17 Jun, 2022
Golden AI
Edits made to:
Infobox (+1 properties)
Infobox
Website URL
Edits on 25 Nov, 2021
Golden AI
Edits made to:
Infobox (+7 properties)
US Patent 07355124 Multilayer wiring board and its manufacturing method
Infobox
Is a
Patent jurisdiction
Patent number
07355124
Date of patent
April 8, 2008
Patent application number
11180780
Date Filed
July 14, 2005
Patent primary examiner
Find more entities like US Patent 7355124 Multilayer wiring board and its manufacturing method
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
