US Patent 7355173 Delineation of wafers
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Patent abstract
A method of junction delineation of non-epitaxial wafers comprises the steps of preparing a sample of the wafer, staining the sample using a mixture of between one and three parts hydrofluoric acid to fifty parts nitric acid to twenty parts water, and scanning the sample with a scanning electron microscope.
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US Patent 07355173 Delineation of wafers US Patent 7355173 Delineation of wafers
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Patent Number
0735517300
Patent Number
735517300
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Infobox
Is a
Patent Jurisdiction
Patent Number
073551730
Date of Patent
April 8, 2008
0Patent Application Number
110305000
Date Filed
January 6, 2005
0Official Website
Patent Primary Examiner
Edits on 28 Sep, 2022
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
073551730
Date of Patent
April 8, 2008
0Patent Application Number
110305000
Date Filed
January 6, 2005
0Official Website
Patent Primary Examiner
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US Patent 07355173 Delineation of wafers
Infobox
Is a
Patent jurisdiction
Patent number
07355173
Date of patent
April 8, 2008
Patent application number
11030500
Date Filed
January 6, 2005
Patent primary examiner
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