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US Patent 7357017 Wafer level capped sensor

Patent 7357017 was granted and assigned to Analog Devices on April, 2008 by the United States Patent and Trademark Office.

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Patent abstract

A sensor has a die (with a working portion), a cap coupled with the die to at least partially cover the working portion, and a conductive pathway extending through the cap to the working portion. The pathway provides an electrical interface to the working portion.

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