US Patent 7357017 Wafer level capped sensor
Patent 7357017 was granted and assigned to Analog Devices on April, 2008 by the United States Patent and Trademark Office.
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Patent Inventor Names
Carl M. Roberts0
Kieran P. Harney0
Lawrence E. Felton0
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Patent abstract
A sensor has a die (with a working portion), a cap coupled with the die to at least partially cover the working portion, and a conductive pathway extending through the cap to the working portion. The pathway provides an electrical interface to the working portion.
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US Patent 07357017 Wafer level capped sensor US Patent 7357017 Wafer level capped sensor
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Patent Number
07357017
Patent Number
7357017
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Official Website
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US Patent 07357017 Wafer level capped sensor
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Is a
Current assignee
Patent jurisdiction
Patent number
07357017
Date of patent
April 15, 2008
Patent application number
11836205
Date Filed
August 9, 2007
Patent primary examiner
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